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MXJ Lead Solder Paste Syringe Sn63/Pb37 Granularity/Microns 4um for SMT Electronics Repair MXJ-40Z

Description

MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder paste.

Features
Lead solder paste, melting point, 183℃
Viscosity: 100 (Pa·S)
Granularity :4 (um)
Strong viscosity; fine particles; fine paste
Excellent wettability: the surface after being opened for a long time
It is still wet and does not affect welding
Resistant to medium temperature, less residue, strong upper tin, bright soldering spot
Working temperature: 200 (℃)

Product form

MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder... Read more

1 in stock

Dhs. 45.00 Incl. VAT

    • Shipped today? Order within: May 09, 2024 13:00:00 +0400

    Description

    MXJ-40Z is widely used for SMT patch tin planting, cell phone, computer repair, chip planting. One of the best solder paste.

    Features
    Lead solder paste, melting point, 183℃
    Viscosity: 100 (Pa·S)
    Granularity :4 (um)
    Strong viscosity; fine particles; fine paste
    Excellent wettability: the surface after being opened for a long time
    It is still wet and does not affect welding
    Resistant to medium temperature, less residue, strong upper tin, bright soldering spot
    Working temperature: 200 (℃)

    Reviews

    MXJ Lead Solder Paste Syringe Sn63/Pb37 Granularity/Microns 4um for SMT Electronics Repair MXJ-40Z

    MXJ Lead Solder Paste Syringe Sn63/Pb37 Granularity/Microns 4um for SMT Electronics Repair MXJ-40Z

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