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  • Mechanic 0.3 0.4 0.5 0.6mm Soldering Wire Tin/Lead 63/37 Special Purpose Solder Wire TY-V866

    Mechanic Mechanic 0.3 0.4 0.5 0.6mm Soldering Wire Tin/Lead 63/37 Special Purpose Solder Wire TY-V866

    40 in stock

    Mechanic TY-V866 Special Purpose Series gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts. Specification Size available to choose 0.3 / 0.4 / 0.5 / 0.6mm Gross Weight 40g Tin/Lead Content Ratio: 63/37 CJ(Flux) 0.05%, Expansion 75% Flux 1.0%-3.0% Features Excellent Tin wire for motherboards & Mobile phones repair works High tin content, plump solder joints and good soldering ability Contains rosin with low melting point, continuous core Raw materials are used, in strict accordance with the requirements of GB3131-82 Suitable for the majority of maintenance masters Note: Please choose the right size for your requirement before placing your order.

    40 in stock

    Dhs. 15.95

  • Mechanic 35g Lead Solder Paste XG50, Sn63/Pb37 3-Microns for SMT Electronics Repair

    Mechanic Mechanic 35g Lead Solder Paste XG50, Sn63/Pb37 3-Microns for SMT Electronics Repair

    Out of stock

    A superb leaded solder paste. Sn63/Pb37 eutectic formula goes directly from a liquid to solid state as it cools and vise-versa. Great for reballing BGA chips with stencils, soldering connectors, and more! Suitable for mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.Features Flux: IPX3Alloy: Sn63 Pb37Lead solder paste, melting point, 183℃Microns/Granularity :3 (um)Strong viscosity; fine particles; fine pasteExcellent wettability: the surface after being opened for a long timeIt is still wet and does not affect weldingResistant to medium temperature, less residue, strong upper tin, bright soldering spotWorking temperature: 200 (℃)

    Out of stock

    Dhs. 24.95

  • Mechanic UV50 Soldering Flux Paste No-Clean Lead-Free Welding Flux For PCB BGA PGA SMD Rework Tool

    Mechanic Mechanic UV50 Soldering Flux Paste No-Clean Lead-Free Welding Flux For PCB BGA PGA SMD Rework Tool

    10 in stock

    Mechanic UV50 Solder Paste Tflux is a butter-like ointment with high bonding strength, neutral pH, strong insulation and smooth welding surface. It is suitable for flux soldering in precision electronic product, PCB, BGA, etc. High quality soldering flux with excellent performance. Use without concerns – not corrosiveto integrated circuit board. Its boiling point is slightly higher than that of soldering tin. Lightweight with small volume, easy and convenient to use. Easy and durable soldering with this flux, as well as fast cleaningand good insulation. Ideal for flux soldering in precision electronic product, PCB, BGA,etc. Instructions: Wipe the surface of the object before soldering. Apply the paste flux to the solder joint. Solder the tin to the solder joint with soldering iron.

    10 in stock

    Dhs. 24.95

  • Mechanic XG30 Lead-Free Soldering Paste 30g for PCB, Mobile Phone Repair, and BGA Welding

    Mechanic Mechanic XG30 Lead-Free Soldering Paste 30g for PCB, Mobile Phone Repair, and BGA Welding

    5 in stock

    Mechanic XG30 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It has a low melting point of 183°C, making it easy to use and preventing the solder from solidifying before it can be applied. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Alloy Sn63 / Pb37 Rosin flux IPX3 Microns 3# Produces high-quality solder joints Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Applications: PCB repair Electronic component soldering BGA welding Mobile phone repair

    5 in stock

    Dhs. 22.95

  • Mechanic XG40 Lead-Free Soldering Paste 30g for PCB, Mobile Phone Repair, and BGA Welding

    Mechanic Mechanic XG40 Lead-Free Soldering Paste 30g for PCB, Mobile Phone Repair, and BGA Welding

    5 in stock

    Mechanic XG40 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It has a low melting point of 183°C, making it easy to use and preventing the solder from solidifying before it can be applied. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Alloy Sn63 / Pb37 Rosin flux IPX3 Microns 3# Produces high-quality solder joints Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Applications: PCB repair Electronic component soldering BGA welding Mobile phone repair

    5 in stock

    Dhs. 24.95

  • Mechanic XGSP50 Soldering Paste 42g, Sn63Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding

    Mechanic Mechanic XGSP50 Soldering Paste 42g, Sn63Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding

    Out of stock

    Mechanic XGSP50 is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-lead alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Alloy Sn63 Pb37 Rosin flux IPX3 Microns 3# Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for PCB, mobile phone repair, and BGA welding applications This product is ideal for use in a variety of applications, including: Repairing PCB circuit boards Soldering electronic components BGA welding Mobile phone repair The Mechanic XGSP50 solder paste is a reliable and effective way to solder electronic components. It is easy to use and provides excellent performance.

    Out of stock

    Dhs. 39.95

  • Mechanic XGSP80 Soldering Paste 60g, Sn63 Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding

    Mechanic Mechanic XGSP80 Soldering Paste 60g, Sn63 Pb37, 3# Microns IPX3 Suitable for PCB, Mobile Phone Repair, Chip Planting and BGA Welding

    5 in stock

    Mechanic XGSP80 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-lead alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Alloy Sn63 Pb37 Rosin flux IPX3 Microns 3# Easy to use Produces high-quality solder joints Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Applications: PCB repair Electronic component soldering BGA welding Mobile phone repair

    5 in stock

    Dhs. 49.00

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