Products

JASTON JSD-9003 is high purity disposable active solder wire. This Leaded solder wire Sn63/Pb37 is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.Specification Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm Gross Weight 50g Tin/Lead Content Ratio: 63/37 Expansion 75% Flux 1.0%-3.0% (Flux with Rosin) Features Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C Excellent Tin wire for motherboards & Mobile phones repair works High tin content, plump solder joints and good soldering ability Contains rosin with low melting point, continuous core Raw materials are used, in strict accordance with the requirements of GB3131-82 Suitable for the majority of maintenance masters Note: Please choose the right size for your requirement before placing your order.

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JASTON JSD-9001X is small pack solder wire with rosin core is small volume, which is easy for small repair works. It is a mini Leaded & Rosin Flux solder wire Sn63/Pb37 reel. It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.Specification Diameter 0.8mm Gross Weight 9 gram (mini) Tin(Sn) 63%, Lead(Pb) 37% Expansion 75% Flux 1.0%-3.0% (Flux with Rosin) Features Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C Excellent Tin wire for motherboards & Mobile phones repair works High tin content, plump solder joints and good soldering ability Contains rosin with low melting point, continuous core Raw materials are used, in strict accordance with the requirements of GB3131-82 Suitable for the majority of maintenance masters

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JASTON JSD-802UV is a UV light curing solder mask green oil that is used to protect PCB circuit boards from corrosion, moisture, and other environmental factors. It is also used to insulate flying leads and prevent them from shorting out. The green oil is easy to apply and dries quickly under UV light. It is also non-toxic and environmentally friendly. This product is ideal for use in a variety of applications, including: Repairing PCB circuit boards Insulating flying leads Protecting PCB circuit boards from corrosion and moisture The JASTON JSD-802UV UV light curing solder mask green oil is a reliable and effective way to protect your PCB circuit boards. It is easy to use and provides excellent performance. Here are some of the key features of the JASTON JSD-802UV UV light curing solder mask green oil: UV light curing Protects PCB circuit boards from corrosion, moisture, and other environmental factors Insulates flying leads and prevents them from shorting out Easy to apply Dries quickly under UV light Non-toxic and environmentally friendly

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The JASTON JSD-1043K is a high-performance golden thermal grease that is designed to transfer heat away from CPU, GPU, chipset, and LED components. It has a thermal conductivity of >3.6 W/m·K, which is higher than most other thermal greases on the market.  It also has a low viscosity, making it easy to apply and spread.  The JSD-1043K is compatible with a wide range of applications and has a working temperature range of -30 to 300°C.  This makes it a great choice for a variety of electronic devices, including computers, laptops, smartphones, and tablets.

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JASTON JSD-16S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Features: Lead-based Tin-lead alloy Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications Small size, easy to carry Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Portable and easy to carry Applications: BGA rework Mobile phone repair Chip planting Electronic component soldering

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Jaston JSD-17S Lead-Free BGA Rework Solder Paste is a high-quality, lead-free solder paste that is ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications. It has a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Features: Lead-free Tin-silver-copper alloy Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications Small size, easy to carry Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Portable and easy to carry Applications: BGA rework Mobile phone repair Chip planting Electronic component soldering

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JASTON JSD-18S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Features: Lead-based Tin-lead alloy Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications Higher melting point than Jaston JSD-16S Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Portable and easy to carry Ideal for applications where a higher melting point is required Applications: BGA rework Mobile phone repair Chip planting Electronic component soldering

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The JASTON JSD-202A is a no-clean rosin flux paste that is designed for use in the soldering and rework of electronics products. It is a high-quality flux paste that is made with lead-free materials, making it environmentally friendly. The JASTON JSD-202A has a number of features that make it ideal for mobile phone motherboard maintenance and soldering, including: It is a no-clean flux paste, which means that there is no need to clean the PCB after soldering. This saves time and money. It is a high-quality flux paste that is made with lead-free materials, making it environmentally friendly. It has a high activity, which means that it is effective at removing the oxide layer on the metal surface of the component. It has a low viscosity, which makes it easy to apply and spread. It produces less smoke, which makes it safer to work with. It is compatible with a wide range of electronic components. The JASTON JSD-202A is a versatile flux paste that can be used for a variety of soldering and rework applications. It is a good choice for mobile phone motherboard maintenance and soldering, as well as other electronic assembly applications.

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Jaston JSD-203A Rosin Flux Paste is a high-quality, rosin flux paste that is ideal for soldering, PCB repair, and BGA welding applications. It is made with a rosin flux, which makes it easy to use and produces high-quality solder joints. The flux paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Features: Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for soldering, PCB repair, and BGA welding applications Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Easy to use Produces high-quality solder joints Consistent and reliable performance Applications: Soldering PCB repair BGA welding

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Jaston JSD-3180 No-Clean Lead-Free Soldering Paste is a high-quality, no-clean lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Viscosity: 100 mPa·s Graininess: 20 μm Alloy composition: Rosin Melting point: 180°C Type: Soldering paste Operating temperature: 300°C Features: No-clean Lead-free Tin-silver-copper alloy Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for PCB, mobile phone repair, and BGA welding application Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones No need to clean after use Produces high-quality solder joints Consistent and reliable performance Applications: PCB repair Electronic component soldering BGA welding Mobile phone repair

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This product is a clean soldering iron tip product that does not contain acid. It effectively eliminates the problems of easy to break, easy black, and no tin caused by acid corrosion of the soldering iron tip; the cleaning effect is excellent, and there is no benzene-containing co-derivative.  Features: Can remove oxides on the soldering tip; The nozzle can be returned to light and re-tinned; Does not contain diammonium phosphate, flux residue, will not damage the board. Weight: Approx. 36g Usage: Soldering iron head cleaning Packing: 1 x Soldering Iron Tip Refresher Clean Paste

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The JASTON JSD-559X-TF is a lead-free BGA solder paste that is perfect for mobile phone repair. It is no-clean, environmentally, and has a low halogen content. The solder paste has a viscosity of 100 (Pa·S) and a graininess of 0 (um). It is made with a solder oil alloy that has a melting point of 180 degrees Celsius. The solder paste is also compatible with a wide range of electronic components. Key Features: Lead-free, No-clean, Environmentally friendly Low halogen, High transfer efficiency, Rosin flux Good liquidity, Bright solder joints, Little smoke Applications: Mobile phone repair PCB, BGA, CSP and other packages CSP rework Other electronic assembly applications

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The JASTON JSD-1042Y is a high-performance silver thermal grease that is designed to transfer heat away from CPU, GPU, chipset, and LED components. It has a thermal conductivity of >3.78 W/m·K, which is higher than most other thermal greases on the market.  It also has a low viscosity, making it easy to apply and spread.  The JSD-1042Y is compatible with a wide range of applications and has a working temperature range of -30 to 300°C.  This makes it a great choice for a variety of electronic devices, including computers, laptops, smartphones, and tablets.

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Effectively cleans soldering iron tips without water, better than conventional sponges. Jaston JSD-1006 mesh ball is made of copper, and the wire absorption effect is excellent. Widely used in mechanical cleaning and cleaning of accessories, molds, welding iron tip molds, etc.

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The JASTON JSD-1040H is a high-performance silver thermal grease that is designed to transfer heat away from CPU, GPU, chipset, and LED components. It has a thermal conductivity of >1.96 W/m·K, which is higher than most other thermal greases on the market.  It also has a low viscosity, making it easy to apply and spread.  The JSD-1040H is compatible with a wide range of applications and has a working temperature range of -30 to 230°C.  This makes it a great choice for a variety of electronic devices, including computers, laptops, smartphones, and tablets.

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Cleans soldering welding iron tips without water, better than conventional sponges. It doesn't need water so that will not reduce the tip's temperature Your solder iron tip will be cleaned cleaner and faster When you clean your soldering iron tip, there won't have tin residual out the container, which will keep your workbench cleaning Smokeless, tasteless, non-toxic and saves the energy

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